Fanless PC 12th-Gen Core™ i9/ i7/ i5/ i3, 4x GbE, 4x USB3.2, -25°C to 60°C 1x Hot-swappable SSD

Product code: EPC-I12X4E6U4SVD

Intel® 12th-Gen Core™ 35W/ 65W LGA1700 CPU
4x GbE and 4x USB3.2 Gen 1 with screw-lock
1x hot-swappable HDD tray
1x M.2 2280 Gen4 x4 NVMe 
2x full-size mPCIe sockets
4-CH isolated DI and 4-CH isolated DO
VGA + DP 
TPM Support
Rugged, -25°C to 60°C fanless operation
212 x 165 x 63 mm low-profile design

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    Is one of the most compact fanless embedded computers based on the Intel 12th -Gen Alder Lake platform. Measuring just 212 x 165 x 63 mm, it can fit into restricted spaces, such as in robotic arm and AMR applications. Despite its compact size, it does not compromise on performance. Built on Intel's 7nm process, Intel 12th Gen processors have up to 16 cores/ 24 threads to deliver up to 1.8x the performance when compared to previous Intel 10th or 11th Gen platforms. It is a compact fanless embedded computer that can provide the ultimate computing for various industrial applications.

    It has rich I/O functions. It features four GbE and four USB3.2 Gen 1 ports for multiple camera connectivity. In addition, it features a Gen4 x4 M.2 NVMe slot for the latest NVMe SSDs that support read/ write speeds up to 7000 MB/s. It also has another hot-swappable HDD tray to hot-swap the storage drive without turning off the system or dismantling the chassis. There are two mPCIe and one M.2 E key slots to install WiFi or 5G/ 4G for wireless communication needs. In addition, it is also equipped with 8x DIO, 2x COM ports, and dual display outputs for your application needs.

     

    As a compact embedded computer, it delivers excellent computing performance and offers an abundance of I/O connections. It is suitable for a variety of industrial applications, especially when installation space is limited. It is the ideal compact fanless computer for the industrial market.

    EPC-I12X4E6U4SVD
    1 Item

    Data sheet

    Weight
    2.5KG
    CPU
    12th-Gen Alder Lake Core™ CPU (LGA1700 socket, 35W/ 65W TDP) - i9-12900E/ i9-12900TE - i7-12700E/ i7-12700TE - i5-12500E/ i5-12500TE - i3-12100E/ i3-12100TE - G7400E/ G7400TE - Celeron® G6900E/ G6900TE
    Forsyning
    1x 3-pin pluggable terminal block for 8-48V DC input with optional ignition power contro
    Udgange
    1x VGA output, supporting 1920 x 1200 resolution 1x DisplayPort, supporting 4096 x 2304 resolution
    Driftstemperatur
    with 35W CPU -25°C ~ 60°C * with 65W CPU (installation of the optional fan kit is recommended) -25°C ~ 60°C */** SSD and RAM needs WT spec! 65W needs fan
    Porte
    1x software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
    Chipset
    Intel® 600 Series PCH platform controller hub
    Effekt
    from 130watt to 146watt depens on CPU
    Hukommelse
    Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
    Lyd
    1x 3.5 mm jack for mic-in and speaker-out
    Montering
    Wall-mount (standard) or DIN-rail mount (optional)
    Ethernet
    4x Gigabit Ethernet ports by 4x I210
    USB
    4x USB 3.2 Gen1 (5 Gbps) ports 2x USB 2.0 ports
    Digital I/O
    Isolated DIO DIO 4-CH isolated DI and 4-CH isolated DO
    Dimensioner
    212 mm (W) x 165 mm (D) x 63 mm (H)
    Grafik
    Integrated Intel® UHD Graphics 770 (32EU)
    Chok/Vibration
    Vibration Operating, MIL-STD-810G, Method 514.6, Category 4 Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
    Approval
    CE/FCC Class A, according to EN 55032 & EN 55035
    mPCIe
    2x full-size mini PCI Express sockets with internal SIM sockets
    TPM
    Supports dTPM 2.0
    M.2
    1x M.2 2230 E key socket for WiFi5, WiFi6 or Google edge TPU module
    SSD
    1x hot-swappable 2.5" HDD/ SSD tray, 1x M.2 2280 M key socket (PCIe Gen4 x4) for NVMe SSD